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LY-G850 Semi-automatic 3 Zones Max 50x45cm Big Area Hot Air Align BGA Rework Station 220V 6800W
Parameter
|
Power |
6800W |
|
Up heater power |
1200W |
|
Down heater power |
1200W |
|
IR heater power |
4200W(2400W control) |
|
Power supply |
(Single Phase) AC 220V±10 50Hz |
|
Position way |
Optical lens+ Vshape holder+laser positioning |
|
Temperature control |
High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃ |
|
Material |
High sensitive touch screen+temperature control module+PLC+step drive |
|
PCB Size |
Max:500×450mm ， Min: 10×10mm |
|
Thermo-couple Ports |
4pcs |
|
Chips magnification times |
2-30 |
|
PCB thickness |
0.5-8mm |
|
BGA size |
0.8mm-8cm |
|
Min.chips pitch |
0.15mm |
|
Mounting BGA weight |
1000G |
|
Mounting precision |
±0.01mm |
|
Overall dimension |
L670×W780×H850mm |
|
Optical alignment lens |
Motor drive can move front back right left |
|
Weight of machine |
About 90kg |
LY G850 BGA Rework station Feature
· Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.
· PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate.
· Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling.
· Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction model weld,remove,mount,manual,realize semi auto and auto function ,meet customer’s requirement
· High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
· Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
· Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
· High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
· Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )
Item pictures
